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Freescale Semiconductor Technical Data
MMA6260Q Rev. 2, 10/2004
1.5g Dual Axis Micromachined Accelerometer
The MMA6200 series of low cost capacitive micromachined accelerometers feature signal conditioning, a 1-pole low pass filter and temperature compensation. Zero-g offset full scale span and filter cut-off are factory set and require no external devices. A full system self-test capability verifies system functionality.
Features
* * * * * * * * * * High Sensitivity Low Noise Low Power 2.7 V to 3.6 V Operation 6mm x 6mm x 1.98 mm QFN Integral Signal Conditioning with Low Pass Filter Linear Output Ratiometric Performance Self-Test Robust Design, High Shocks Survivability
MMA6260Q MMA6261Q MMA6262Q MMA6263Q
MMA6260Q Series: X-Y AXIS SENSITIVITY MICROMACHINED ACCELEROMETER 1.5 g
Bottom View
Typical Applications
* * * * * * * Tilt Monitoring Position & Motion Sensing Freefall Detection Impact Monitoring Appliance Control Vibration Monitoring and Recording Smart Portable Electronics
16 LEAD QFN
CASE 1477-01
ORDERING INFORMATION
Pin Assignment Top View
Bandwidth Response 50 Hz 50 Hz 300 Hz 300 Hz 150 Hz 150 Hz 900 Hz 900 Hz IDD 1.2 mA 1.2 mA 1.2 mA 1.2 mA 2.2 mA 2.2 mA 2.2 mA 2.2 mA
XOUT
YOUT
Device Name MMA6260Q MMA6260QR2 MMA6261Q MMA6261QR2 MMA6262Q MMA6262QR2 MMA6263Q MMA6263QR2
Case No. 1477-01 1477-01 1477-01 1477-01 1477-01 1477-01 1477-01 1477-01
Package QFN-16, Tube QFN-16,Tape & Reel QFN-16, Tube QFN-16,Tape & Reel QFN-16,Tube QFN-16,Tape & Reel QFN-16, Tube QFN-16,Tape & Reel
N/C N/C N/C
16 15 14 13 1 2 12 ST 11 10 9 5
N/C N/C N/C N/C
VDD 3 VSS 4
6
N/C
7
N/C
8
N/C
(c) Freescale Semiconductor, Inc., 2004. All rights reserved.
N/C
VDD
G-CELL SENSOR X-INTEGRATOR X-GAIN X-FILTER X-TEMP COMP
XOUT
ST
SELF-TEST
CONTROL LOGIC & EEPROM TRIM CIRCUITS
OSCILLATOR
CLOCK GEN
Y-INTEGRATOR
Y-GAIN
Y-FILTER
Y-TEMP COMP
YOUT VSS
Figure 1. Simplified Accelerometer Functional Block Diagram
MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Rating Maximum Acceleration (all axis) Supply Voltage Drop Test1 Symbol gmax VDD Ddrop Tstg Value Unit g V m C
2000
-0.3 to +3.6 1.2 -40 to +125
Storage Temperature Range Note: 1. Dropped onto concrete surface from any axis.
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic discharge. Although the Freescale Semiconductor accelerometers contain internal 2000 V ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the performance or cause failure of the chip. When handling the accelerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance.
MMA6200 SERIES 2 Sensor Device Data Freescale Semiconductor
Operating Characteristics
Unless otherwise noted: -20C < TA < 85C, 3.0 V < VDD < 3.6 V, Acceleration = 0g, Loaded output1
Characteristic Operating Range2 Supply Voltage3 Supply Current MMA6260Q, MMA6261Q MMA6262Q, MMA6263Q Operating Temperature Range Acceleration Range Output Signal Zero g (TA = 25C, VDD = 3.3 V)4 Zero g Sensitivity (TA = 25C, VDD = 3.3 V) Sensitivity Bandwidth Response MMA6260Q MMA6261Q MMA6262Q MMA6263Q Nonlinearity Noise MMA6260Q RMS (0.1 Hz - 1 kHz) MMA6261Q RMS (0.1 Hz - 1 kHz) MMA6262Q RMS (0.1 Hz - 1 kHz) MMA6263Q RMS (0.1 Hz - 1 kHz) Power Spectral Density RMS (0.1 Hz - 1 kHz) MMA6260Q, MMA6261Q MMA6262Q, MMA6263Q Self-Test Output Response Input Low Input High Pull-Down Resistance5 Response Time6 Output Stage Performance Full-Scale Output Range (IOUT = 200 A) Capacitive Load Drive7 Output Impedance Power-Up Response Time MMA6260Q MMA6261Q MMA6262Q MMA6263Q Mechanical Characteristics Transverse Sensitivity8 VDD IDD IDD TA gFS VOFF VOFF, TA S S, TA f_3dB f_3dB f_3dB f_3dB NLOUT nRMS nRMS nRMS nRMS nPSD nPSD VST VIL VIH RPO tST VFSO CL ZO tRESPONSE tRESPONSE tRESPONSE tRESPONSE VZX, YX, ZY 2.7 -- -- -20 -- 1.485 -- 740 -- -- -- -- -- -1.0 -- -- -- -- -- -- 0.9 VDD -- 0.7 VDD 43 -- VSS +0.25 -- -- -- -- -- -- -5.0 3.3 1.2 2.2 -- 1.5 1.65 2.0 800 0.015 50 300 150 900 -- 1.8 3.5 1.3 2.5 300 200 -- -- -- 57 2.0 -- -- 50 14 2.0 4.0 0.7 -- 3.6 1.5 3.0 +85 -- 1.815 -- 860 -- -- -- -- -- +1.0 -- -- -- -- -- -- VDD 0.3 VDD VDD 71 -- VDD -0.25 100 300 -- -- -- -- +5.0 V mA mA C g V mg/C mV/g %/C Hz Hz Hz Hz % FSO mVrms Symbol Min Typ Max Unit
ug/Hz
V V V k ms V pF ms ms ms ms % FSO
Notes: 1. For a loaded output, the measurements are observed after an RC filter consisting of a 1.0 k resistor and a 0.1 F capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 2.7 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and - acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2. 5. The digital input pin has an internal pull-down resistance to prevent inadvertent self-test initiation due to external board level leakages. 6. Time for the output to reach 90% of its final value after a self-test is initiate. 7. Preserves phase margin (60) to guarantee output amplifier stability. 8. A measure of the device's ability to reject an acceleration applied 90 from the true axis of sensitivity.
MMA6200 SERIES Sensor Device Data Freescale Semiconductor 3
PRINCIPLE OF OPERATION
The Freescale Semiconductor accelerometer is a surfacemicromachined integrated-circuit accelerometer. The device consists of a surface micromachined capacitive sensing cell (g-cell) and a signal conditioning ASIC contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined cap wafer. The g-cell is a mechanical structure formed from semiconductor materials (polysilicon) using semiconductor processes (masking and etching). It can be modeled as a set of beams attached to a movable central mass that move between fixed beams. The movable beams can be deflected from their rest position by subjecting the system to an acceleration (Figure 2). As the beams attached to the central mass move, the distance from them to the fixed beams on one side will increase by the same amount that the distance to the fixed beams on the other side decreases. The change in distance is a measure of acceleration. The g-cell plates form two back-to-back capacitors (Figure 2). As the center plate moves with acceleration, the distance between the plates changes and each capacitor's value
SPECIAL FEATURES
Filtering
These Freescale Semiconductor accelerometers contain an onboard single-pole switched capacitor filter. Because the filter is realized using switched capacitor techniques, there is no requirement for external passive components (resistors and capacitors) to set the cut-off frequency.
Self-Test
The sensor provides a self-test feature allowing the verification of the mechanical and electrical integrity of the accelerometer at any time before or after installation. A fourth plate is used in the g-cell as a self-test plate. When a logic high input to the self-test pin is applied, a calibrated potential is applied across the self-test plate and the moveable plate. The resulting electrostatic force (Fe = 1/2 AV2/d2) causes the center plate to deflect. The resultant deflection is measured by the accelerometer's ASIC and a proportional output voltage results. This procedure assures both the mechanical (g-cell) and electronic sections of the accelerometer are functioning. Freescale Semiconductor accelerometers include fault detection circuitry and a fault latch. Parity of the EEPROM bits becomes odd in number. Self-test is disabled when EEPROM parity error occurs.
will change, (C = A/D). Where A is the area of the plate, is the dielectric constant, and D is the distance between the plates.
The ASIC uses switched capacitor techniques to measure the g-cell capacitors and extract the acceleration data from the difference between the two capacitors. The ASIC also signal conditions and filters (switched capacitor) the signal, providing a high level output voltage that is ratiometric and proportional to acceleration.
Ratiometricity
Ratiometricity simply means the output offset voltage and sensitivity will scale linearly with applied supply voltage. That is, as supply voltage is increased, the sensitivity and offset increase linearly; as supply voltage decreases, offset and sensitivity decrease linearly. This is a key feature when interfacing to a microcontroller or an A/D converter because it provides system level cancellation of supply induced errors in the analog to digital conversion process.
Acceleration
Figure 2. Simplified Transducer Physical Model
MMA6200 SERIES 4 Sensor Device Data Freescale Semiconductor
BASIC CONNECTIONS Top View
ST XOUT YOUT VSS VDD R 1 k R 1 k C 0.1 F VRH C 0.1 F C 0.1 F A/D IN C 0.1 F A/D IN MICROCONTROLLER ACCELEROMETER P0
XOUT
YOUT
N/C
N/C
VSS C 0.1 F VDD
16 15 14 13
N/C N/C
1 2
12 ST 11 10 9 5
N/C N/C N/C N/C
VDD 3 VSS 4
6
N/C
7
N/C
8
N/C
POWER SUPPLY
Figure 3. Pinout Description
Figure 5. Recommend PCB Layout for Interfacing Accelerometer to Microcontroller
Pin No. 1, 5 - 7, 13, 16 14 15 3 4 2, 8 - 11 12
Pin Name N/C YOUT XOUT VDD VSS N/C ST
Description No internal connection. Leave unconnected. Output voltage of the accelerometer. Y Direction. Output voltage of the accelerometer. X Direction. Power supply input. The power supply ground. Used for factory trim. Leave unconnected. Logic input pin used to initiate self-test.
VDD 3 0.1 F 4
MMA6260Q Series VDD YOUT 14 1 k
0.1 F VSS XOUT 15 ST 1 k
Notes: 1. Use 0.1 F capacitor on VDD to decouple the power source. 2. Physical coupling distance of the accelerometer to the microcontroller should be minimal. 3. Flag underneath package is connected to ground. 4. Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all of the open ended terminals shown in Figure 5. 5. Use an RC filter with 1.0 k and 0.1 F on the outputs of the accelerometer to minimize clock noise (from the switched capacitor filter circuit). 6. PCB layout of power and ground should not couple power supply noise. 7. Accelerometer and microcontroller should not be a high current path. 8. A/D sampling rate and any external power supply switching frequency should be selected such that they do not interfere with the internal accelerometer sampling frequency (16 kHz for Low IDD and 52 kHz for Standard IDD for the sampling frequency). This will prevent aliasing errors.
12
Logic Input
0.1 F
Figure 4. Accelerometer with Recommended Connection Diagram
MMA6200 SERIES Sensor Device Data Freescale Semiconductor 5
DYNAMIC ACCELERATION Top View
+Y
16 15 14 13 1 12 11 10 9 5 6 7 8
+X
2 3 4
-X
-Y
16-Pin QFN Package
STATIC ACCELERATION Top View
Direction of Earth's gravity field.*
XOUT @ 0g = 1.65V YOUT @ -1g = 0.85V
XOUT @ +1g = 2.45V YOUT @ 0g = 1.65V
XOUT @ -1g = 0.85V YOUT @ 0g = 1.65V
XOUT @ 0g = 1.65V YOUT @ +1g = 2.45V * When positioned as shown, the Earth's gravity will result in a positive 1g output
MMA6200 SERIES 6 Sensor Device Data Freescale Semiconductor
PIN 1 INDEX AREA
6
2X
A 0.15 C G
M 0.1 C 1.98+0.1 0.08 C (0.5) (1) DETAIL G C
SEATING PLANE
5
6 (0.203) (0.102)
2X
B
0.15 C
M
VIEW ROTATED 90 CLOCKWISE
0.1 C A B
EXPOSED DIE ATTACH PAD
13
4
16X DETAIL M PIN 1 INDEX
0.1
(45)
4.24 4.04
16
DETAIL M 4.24 4.04 0.1 C A B
9 4 12 1
0.5
NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. THIS DIMENSION APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25MM AND 0.30MM FROM TERMINAL TIP. 4. THIS DIMENSION REPRESENTS TERMINAL FULL BACK FROM PACKAGE EDGE UP TO 0.1MM IS ACCEPTABLE. 5. COPLANARITY APPLIES TO THE EXPOSED HEAT SLUG AS WELL AS THE TERMINAL. 6. RADIUS ON TERMINAL IS OPTIONAL.
12X
8 5
1
16X
0.63 0.43 VIEW M-M
16X
0.60 0.40 0.1
0.05
3
M M
CAB C
CASE 1477-01 ISSUE O
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
6.0
0.55
4.25
12
9
13
6.0
8
1.00
0.50
16
1
4
Pin 1 ID (non metallic)
Solder areas
MMA6200 SERIES Sensor Device Data Freescale Semiconductor 7
5
How to Reach Us:
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MMA6260Q Rev. 2 10/2004

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